Intel 7nm FPGA products will use Foveros 3D stacking

Intel 7nm FPGA will take full advantage of Foveros 3D stacking technology. Intel has three new components in its advanced chip manufacturing: EMIB, Foveros, and ODI. Foveros is Intel’s “3D” stacking technology that allows two silicon bits to be stacked on top of each other, again in a high-bandwidth, low-power implementation. It’s not clear when these new Intel 7nm FPGAs will come to market, and Intel’s own slides show a roadmap where the current 10nm Agilex FPGAs are the main products for 2022. Best guess is that this FPGA technology will arive in 2023.

news source: anandtech / image source: wallpaperaccess

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