Intel 7nm FPGA will take full advantage of Foveros 3D stacking technology. Intel has three new components in its advanced chip manufacturing: EMIB, Foveros, and ODI. Foveros is Intel’s “3D” stacking technology that allows two silicon bits to be stacked on top of each other, again in a high-bandwidth, low-power implementation. It’s not clear when these new Intel 7nm FPGAs will come to market, and Intel’s own slides show a roadmap where the current 10nm Agilex FPGAs are the main products for 2022. Best guess is that this FPGA technology will arive in 2023.